相關新聞
芯片框圖
基本規格
CPU? Quad-Core ARM Cortex?-A53 1.8GHz ? 32KB L1 I-cache + 32KB L1 D-cache per core? 512KB L2 cache ? Low-power CoolFlexTM power management architecture GPU
? Mali-T760 624MHz
Memory? Supports 32-bit DDR3/DDR3L/LPDDR3/LPDDR2
? Supports eMMC 5.0, support Full Disk Encryption(FDE) ? Supports 8-bit TLC/MLC/SLC/EF NAND flash with 80-bit ECC, support FDE Video? Supports HEVC decoder 6K@30fps,4K@60fps
? Supports H.264/ VP9 decoder 4K@30fps ? Supports multi-format 1080P@60fps video playback, including VP8,MPEG1/2, MPEG4 SP/ASP L5, H.263, WMV9/VC-1 ? Supports H264 HP encoder 1080P@30fps ? Supports macro block bit rate control ? Supports JPEG encoder 4096X4096 |
Camera? Supports 8/10bit DC interface
? Supports BT656 interface ? Supports ITU-R BT.656 time-multiplexed format ? Supports image crop function ? Maximum still capture resolution for parallel interface to 5M ? Maximum video capture resolution for parallel interface to 1080P@30fps Audio? Supports stereo ADC and DAC
? Supports five analog audio inputs and three analog audio outputs ? Capless headphone driver Display? Supports output resolution up to 1440x2560@70fps or 1440x1440x2@90fps
? Supports dual Display Engine for high-end VR ? Supports SmartColorTM3.0 for excellent display experience ? Supports Frame Packing/Top-and-Bottom/Side-by-Side Full/Side-by-Side Half 3D format data ? Supports hardware accelerator “Portal ”for ATW, distortion correction,chromatic aberration correction |
Sensor? Supports built-in Sensor Hub
? Supports 9-axis sensor, including accelerometer, gyroscope, magnetometer ? Supports ambient light and proximity sensor Connectivity? USB Host, USB 2.0 OTG
? SDIO 3.0,RSB ? 8x TWI,3x SPI ? 5x UART,3x PWM ? GPADC WIFI? Supports IEEE 802.11 a/b/g/n/ac
OS? Android 7.1 and above
PMIC? Customized AXP802
Package? FCBGA 463
? 15mm x 15mm size,0.65 pitch,0.35 ball size Process? 28nm HPC
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方案亮點
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VR專用加速模塊&屏顯系統
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VR專用影音&交互系統
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低發熱功能&高安全品質
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完整的VR軟件系統方案
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相關新聞
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